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SiP Global Summit 2014

3D IC 技術趨勢論壇

 

Thursday, September 4, 2014

2014年9月4日 星期

08:30 – 17:00 (08:30 - 09:00 為報到時間)

Room 504, 5F, TWTC Nangang Exhibition Hall, Taipei

台北世貿南港展覽館 4F 403會議室

 

   主題:2.5D / 3D IC Enabling Hybrid SiP

 

千住金屬向來致力於新技術的研究與開發,2014 SEMICON SHOW中也即將與IBM公司聯合發表最新的研究技術,歡迎各位業界先進,屆時能夠蒞臨聆聽,並給與指教。

議程

時間 Time

議題/講者 Topic& Speaker

08:30 – 09:00

報到 Registration

09:00 – 09:15

Opening Remark: 2.5D / 3D IC Enabling Hybrid SiP

Dr. Tien Wu, Board of Directors, SEMI

09:15 – 09:40

Plenary Speech

Inviting

09:40 – 10:05

Opening Speech: Market Overview on 3D IC Technology Market Adoption

Ms. Rozalia Beica, Chief Technology Officer, Yole Development

10:05 – 10:30

Keynote Speech: Hybrid Memory Cube, Key to the High-Performance Computing World and the Future of Memory

Scott Graham, GM, Micron

10:30 – 10:45

Networking Break

10:45 – 11:10

Mobile Technology for Wearable & IoT Services

Inviting

11:10 – 11:35

3D End Product System Tech Driven Application

IMEC

11:35 – 12:00

New Generation Si Interposer Solution

Dr. YW Hu, Sr. VP, Inotera

12:00 – 13:30

Lunch Break

13:30 – 13:55

2.5D / 3D IC Effective & Integrated Design

Inviting

13:55 – 14:20

IMS (Injected Molded Solder) Technology For Advanced Solder Bumping on Wfer / Laminates

Dr. Yasumitsu Orii / 折井靖光, Sr. Manager, Science & Technology, IBM Research - Tokyo

Mr. Lewis Huang / 黃智堯, Deputy General Manager, Senju Metal Industry Co., Ltd, Taiwan Branch

14:20 – 14:45

Enabling technologies for 2.5D interposer and 3D IC manufacturing (An Equipment Perspective)

Dr. Thorsten Matthias, Director, Business Development, EVG

14:45 – 15:00

Networking Break

15:00 – 15:25

High Throughout Debonding For 2.5 / 3D IC Thin Wafer Handling

Mr. Stefan Lutter, General Manager of Bonder Division, SUSS MicroTec 

15:25 – 15:50

Next Wave of 2.5D IC Application

Mr. Max Lu, Deputy Director, Engineering Center, SPIL 

15:50 – 17:00

Forum Panel

Topic: TBD

Moderator: Dr. Wei-Chung Lo / 駱韋仲, Director, Package Technology Div./EOL, ITRI

Panelists:

Above speakers

立即前往報名 http://www.leadexpo.com/semicontaiwan2014/sele_program/class_sele.asp